What's New
| 09/06/2022 | Yota Uehigashi, graduate student in our group, received Silver Young Scholar Award for his presentation entitled "Fabrication and electrical characterization of n+-Si/p-diamond heterojunction diodes" in NDNC 2022. | |
| 06/06/2022 | Two authored papers are presented in 15th International Conference on New Diamond and Nano Carbons 2022 (NDNC 2022) (June 6-9, 2022, Kanazawa, Japan). | |
| 01/04/2022 | Osaka Metropolitan University launched. Member list updated. | |
| 22/03/2022 | Three authored and one coauthored papers are presented in The 69th JSAP Spring Meeting 2022 (Hybrid, March 22-26, 2022) [in Japanese]. | |
| 18/03/2022 | GaN HEMTs were succesfully fabricated on nitride epi layers after they had been bonded to diamond (Bonding 1st Approach). Low thermal resistance of HEMTs on diamond was demonstrated. The achievements were press-released [in Japanese]. | |
| 09/02/2022 | Achievements of the “Research and development of high thermal stability interface by direct bonding of diamond”project in the Feasibility Study Program of New Energy and Industrial Technology Development Organization (NEDO) was presented in Debrief Meeting of Feasibility Study Program [in Japanese]. | |
| 16/11/2021 | Yota Uehigashi, graduate student in our group, received Presentation Award (Silver) for his presentation in The 2nd Diamond Related Young Researchers Meeting, subsidiary of 35th Diamond Symposium (sponsored by Japan New Diamond Forum) [in Japanese]. | |
| 11/10/2021 | Ryo Kagawa, graduate student in our group, received Best Student Presentation Award for his presentation in LTB-3D 2021 "Fabrication of GaN/SiC/diamond
structure for efficient thermal management of power device." Dr. Jianbo Liang received Best Presentation Award for his presentation in LTB-3D "Fabrication of Ga2O3/Si direct bonding interface for high power device applications." |
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| 05/10/2021 | Eight authored and one coauthored papers are presented in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021) (Online, Oct. 5-11, 2021). | |
| 10/09/2021 | Three authored and two coauthored papers are presented in The 82nd JSAP Autumn Meeting, 2021 (Online, Sept. 10-13, 2021) [in Japanese]. | |
| 09/09/2021 | Dr. Liang succeeded in direct bonding of GaN to diamond and confirmed the thermal tolerance of bonding interfaces up to 1000 °C. His achievements are press-released on Osaka City University's website [in Japanese]. | |
| 06/09/2021 | Prof. Shigekawa gives an invited talk "Direct bonding of diamond to semiconductors and metals for low thermal resistance modules" in 31st International Conference on Diamond and Carbon Materials (ICDCM 2021) (Online, Sept. 6-9, 2021). | |
| 05/07/2021 | Shigekawa's plenary talk in CS-MANTEH 2021 is outlined in article entitled "Optimal cocktails" (author: Richard Stevenson) in Compound Semiconductor Magazine (Vol. 27, Issue 5) | |
| 05/06/2021 | Prof. Shigekawa gives a seminar "III-V compound semiconductor/Si hybrid tandem solar cells" in Solid State Physics and Applications Division, Japan Society of Applied Physics [https://annex.jsap.or.jp/ohden/2021/annai_20210629.html] (Online, June 29, 2021) [in Japanese]. | |
| 23/05/2021 | Prof. Shigekawa presents an invited plenary talk "Low-temperature direct wafer bonding innovating CS device technologies" in International Conference on Compound Semiconductor Manufacturing Technology (CS-MANTECH 2021) (Online, May 27-June 27, 2021). | |
| 01/04/2021 | Member list updated. |
Message
Our research group was kicked out in Oct. 2011 for proposing and demonstrating
concepts of novel semiconductor devices. Noting that equipments for producing
higher electrical powers with smaller environmental load and lower costs
are strongly sought for so as to realize greener society,we have defined
our research target as demonstrating the potential of solar cells composed
of mechanically-stacked subcells, or hybrid tandem solar cells, as a candidate
for third-generation photovoltaic devices with overwhelming high efficiency
(>50%). We are proceeding on research by developing and integrating
all aspects of relevant technologies (semiconductor device fabrication,
characterization,and so on) in combination with fundamental sciences such
as physics and electronics.
We announce with sincere gratitude that we receive supports from a large
number of institutes and companies. In particular we thank to "Development
of high performance and reliable PV modules to reduce levelized cost of
energy" Project of New Energy and Industrial Technology Development
Organization (NEDO) and "Creative Research for Clean Energy Generation
Using Solar Energy" Project in Core Research for Evolutional Science
and Technology (CREST) programs of Japan Science and Technology Agency
(JST) for their financial supports.
N. Shigekawa
