What's New

01/10/2020 Three authored and one coauthored papers are presented in Symposium for Semiconductor Wafer Bonding: Science, Technology and Applications in ECS PRiME 2020 (online, Oct. 04-09, 2020).
28/09/2020 Our recent activities on direct bonding of diamonds to semiconductors and metals are presented in Innovation Japan sponsored by JST (online, Sept. 28-Nov. 30, 2020) [in Japanese].
08/09/2020 One authored and one coauthored papers are presented in The 81st JSAP Autumn Meeting, 2020 (Online, Sept. 08-11, 2020) [in Japanese].
15/06/2020 Yuki Idutsu, a graduate student in our group, presents her result in an oral session of Area 1 in IEEE 47th PVSC Virtual Meeting.
01/04/2020 Member list updated.
20/11/2019 Our recent activities on direct bonding of diamond with dissimilar materials are presented in poster in NEDO Festa in Kansai 2019 (Osaka, Dec. 17-18, 2019) [in Japanese].
08/11/2019 Our research on surface activated bonding of epitaxially-lifted off III-V PV layers on PET films is presented in 29th International Phovoltaic Science and Engineering Conference (PVSEC-29) (Xi'an, China, Nov. 04-08, 2019).
14/08/2019 Six authored and two coauthored papers are presented in The 80th JSAP Autumn Meeting, 2019 (Sapporo, Japan, Sept. 18-21, 2019) [in Japanese].
14/08/2019 Prof. Martin Kuball and Prof. Michael Uren, University of Bristol, UK, give seminars in Graduate School of Engineering, Osaka City University on Aug. 30, 2019.
14/08/2019 Two papers are presented in 13th Topical Workshop on Heterostructure Microelectronics (TWHM 2019) (Toyama, Japan, Aug. 26-29, 2019).
24/07/2019 Our proposal for research and development of direct bonding of diamond is accepted in NEDO Feasibility Study Program [in Japanese].
07/07/2019 Two papers are presented in 13th International Conference on Nitride Semiconductors 2019 (ICNS-13) (Bellevue, Washington, USA, July 7-12, 2019).
21/05/2019 Seven authored and three coauthored papers are presented in 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019) (Kanazawa, Japan, May 21-25, 2019).
12/05/2019 Dr. Jianbo Liang, associate professor, presents his result entitled "Direct bonging of diamond and Cu at room temperature for power device application" in 13th New Diamond and Nano Carbons Conference (NDNC 2019) (Hualien, Taiwan, May 12-17, 2019).
01/04/2019   Member list updated
09/03/2019 Five authored and one coauthored papers are presented in The 66th JSAP Spring Meeting, 2019 (Tokyo, Japan, March 09-12, 2019) [in Japanese].
09/01/2019   Keita Matsuura, a graduate student in our group, presents his result in an invited talk of The 18th Kansai Colloquium, Electron Devices Workshop of IEEE Electron Devices Society Kansai Chapter on Jan. 24, 2019.

Message

Our research group was kicked out in Oct. 2011 for proposing and demonstrating concepts of novel semiconductor devices. Noting that equipments for producing higher electrical powers with smaller environmental load and lower costs are strongly sought for so as to realize greener society,we have defined our research target as demonstrating the potential of solar cells composed of mechanically-stacked subcells, or hybrid tandem solar cells, as a candidate for third-generation photovoltaic devices with overwhelming high efficiency (>50%). We are proceeding on research by developing and integrating all aspects of relevant technologies (semiconductor device fabrication, characterization,and so on) in combination with fundamental sciences such as physics and electronics.

We announce with sincere gratitude that we receive supports from a large number of institutes and companies. In particular we thank to "Development of high performance and reliable PV modules to reduce levelized cost of energy" Project of New Energy and Industrial Technology Development Organization (NEDO) and "Creative Research for Clean Energy Generation Using Solar Energy" Project in Core Research for Evolutional Science and Technology (CREST) programs of Japan Science and Technology Agency (JST) for their financial supports.

N. Shigekawa